极速飞艇官网开奖

Specialties:

  • Surface Mount Technology - SMT

  • Through Hole Technology - THT

  • Mixed Technology

  • Leaded, Lead Free, Water Soluble and No-clean Solder Applications

Printed Circuit Board (PCB) are traditionally designed at the heart of your products. When it comes time to select a Contract Manufacturer to partner with on something so delicate you should expect the highest standards of quality and precision. At BTW we focus on executing your design by maintaining thorough manufacturing and testing processes to ensure your finite details are met. As a BTW customer we commit to partner with you in providing you with both quality product and exceptional service. Historically, these commitments have proven profitable for many BTW customers. PCB Assembly is the heart of BTW’s business platform. If your PCB is the heart of your design, BTW is the right place for you.

BTW specializes in Surface Mount Technology (SMT), Plated Thru-Hole (PTH), and Mixed Technology assemblies. Our SMT lines consist of fully automatic vision screen printers, multifunctional high-speed Juki placement machines, Automated Optical Inspection (AOI) and thirteen zone convection reflow ovens. Our Juki SMT lines offer a high level of flexibility and throughput enhanced by the on-staff support of two former Juki field service Engineers. Our manufacturing team has over 25 years of Thru-Hole and Mixed Technology placement experience. BTW’s suite of advanced technologies in programmable robotic selective solder and wave solder paired with our experienced hand solder technicians and our tooling and test development expertise can deliver all of your Printed Circuit Board Assembly (PCA) needs in one convenient location.

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Circuit Board Construction

  • Rigid

  • Flexible

  • Combined Construction (Rigid and Flex)

  • Single and Multilayer

  • Alumiclad

Board Thickness: 0.015 - 0.157 inches (0.4 - 4mm)

“Standard” PCB Panel Size: 2.0 x 2.0 inches - 31.50 x 16.14 inches (50.8 x 50.8 - 800 x 410mm)

* BTW is capable of running larger than standard dimensions with proper tooling development

Component Size: 01005 and Larger

Lead Pitch: 0.011 - 0.118 inches (0.3 - 3mm)

Process Control - Aegis Manufacturing Software

  • Barcoded Work In-Progress (WIP) tracking

  • Product Traceability

  • On-line Defect Collection

  • Bill of Material Management

  • Machine Programming

  • Quality Reporting

  • CAD Data Importation

Screen Printing

  • Lead, Lead Free, Water Soluble and No-clean processing

  • EdgeLoc Board Clamping

  • Auto Pin Placement

  • Closed-loop Print Head

  • Squeegee Compliance Routine

  • Quick Change Stencil Wiper

  • Solvent Delivery Method

  • 2D Inspection Capable

Pick and Place

  • SMT - Surface Mount Technology

  • 01005 and larger

  • 11+ Mil Pitch

  • BGA and Micro BGA

Cleaning

  • Aqueous Cleaning

  • Closed Loop De-Ionized Wash

  • Chemical Clean

Inspection

  • 2D Automated Solder Paste

  • SMT Placement

  • AOI - Automated Optical Inspection

  • Real Time X-Ray Imaging

  • Ersa Scope Flip Chip and BGA Inspection

Test

  • ICT - In Circuit Testing

  • Functional Testing

Through-hole

  • Component Lead Forming

  • Manual/Mechanical Assembly

Soldering

  • Lead, Lead Free, Water Soluble and No-clean

  • Solder

  • Wave

  • Reflow

  • Selective / Robotic

  • Hand Soldering

  • PTH & Mixed Technology

Depaneling

  • Nibbler

  • Shear

  • V-Score

  • Router

极速飞艇三期计划

  • Minimum: 1 Unit

  • Maximum: Hundreds of Thousands of units

  • High Mix Low Volume

  • High Volume Low Mix

  • Prototypes

  • New Product Introduction (NPI)

  • Production

  • Post Production